Search

Home
Projects
Posts
Publications
Resume

Light Dark Automatic

Thermal modeling

Thermal integrity analysis for 2.5D/3D Process-in-Momery (PIM) heterogeneous package

Thermal modeling of PIM module for comprehensively anlayzing thermal integrity

Hansol Lee

© 2024 Me. This work is licensed under CC BY NC ND 4.0

Published with Wowchemy — the free, open source website builder that empowers creators.

Cite