Liquid cooling

Thermal integrity analysis for 2.5D/3D Process-in-Momery (PIM) heterogeneous package
Thermal modeling of PIM module for comprehensively anlayzing thermal integrity
Hansol Lee
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Thermal integrity analysis for 2.5D/3D Process-in-Momery (PIM) heterogeneous package
Thermal Performance Prediction of Liquid-cooled Manifold Microchannel (MMC) Heat Sinks with Plate Fins
This material was presented in 2023 KSME TED. The newly developed semi-analytical heat transfer model of MMC heat sinks is proposed and the prediciton of the model shows good agreement with experimental data within 20% margin of error.
Hansol Lee, Sung Jin Kim
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Thermal Performance Prediction of Liquid-cooled Manifold Microchannel (MMC) Heat Sinks with Plate Fins