electronics cooling

One-dimensional modeling of manifold microchannels (MMC) with plate-fins for prediction of thermal performance and flow non-uniformity
This material was presented in 2024 KSME TED. The one-dimensional model which takes into account the effects of non-uniform flow distribution on the thermal performance of manifold microchannels is newly developed. This model enables accurate prediction of thermal performance and flow non-uniformity of MMC.
Hansol Lee, Young Jin Lee, Sung Jin Kim
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One-dimensional modeling of manifold microchannels (MMC) with plate-fins for prediction of thermal performance and flow non-uniformity
Thermal Performance Prediction of Liquid-cooled Manifold Microchannel (MMC) Heat Sinks with Plate Fins
This material was presented in 2023 KSME TED. The newly developed semi-analytical heat transfer model of MMC heat sinks is proposed and the prediciton of the model shows good agreement with experimental data within 20% margin of error.
Hansol Lee, Sung Jin Kim
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Thermal Performance Prediction of Liquid-cooled Manifold Microchannel (MMC) Heat Sinks with Plate Fins