Thermal integrity analysis for 2.5D/3D Process-in-Momery (PIM) heterogeneous package

Thermal modeling of 2.5D/3D PIM heterogeneous package

Hansol Lee
Last updated on Jun 1, 2024 Thermal modeling of heterogeneous package, Thermal modeling, Liquid cooling
PDF Follow
Schematic of PIM heterogeneous package
Thermal modeling of heterogeneous package Thermal modeling Liquid cooling