Hansol Lee

Researcher in KAIST

Applied Heat Transfer Lab.

KAIST

Biography

I am a researcher at the department of mechanical engineering in KAIST. Currently, my research focuses on thermal management of electronics including power/RF devices based on the wide-band gap semiconductors and 3D ICs. I have been conducting research on an embedded liquid cooling device, which is manifold microchannels (MMC), for high-heat flux dissipating electronics (2022-Present). I’m also interested in thermal-electrical transport in semiconductors and thermal-aware advanced packaging technology.

Besides my research, I enjoy playing tennis, reading books, and writing essays about miscellnaeous topics. I also love doing some side projects not related to my major like building my website as you are seeing now.

Download my CV .

Interests

Thermal management of electronics
Embedded liquid cooling
Advanced packaging
Thermal-electrical transport in semiconductors
Heat transfer
Phase change phenomena
Energy conversion

Education

MS in Mechanical Engineering, 2022-2024
Korea Advanced Institute of Science and Technology (KAIST)
BS in Mechanical Engineering, 2015-2022
Korea Advanced Institute of Science and Technology (KAIST)

Projects

Hands-on experience on infrared (IR) measurement and data processing

Calibration of IR camera and simultaneous data processing for estimating local heat flux in pool boiling situation

Thermal-hydraulic modeling of manifold microchannels (MMC) for embedded cooling

One-dimensional model of MMC enabling an accurate prediction of the thermal performance and the flow non-uniformity

Thermal integrity analysis for 2.5D/3D Process-in-Momery (PIM) heterogeneous package

Thermal modeling of PIM module for comprehensively anlayzing thermal integrity

ME514 Design of Cascade Thermosiphon Loop for Data Center Cooling

A novel design of thermosiphon loop for data center cooling purpose

Featured Publications

Hansol Lee, Young Jin Lee, Sung Jin Kim

May, 2024 ICHMT

One-dimensional model of manifold microchannels for embedded cooling: Prediction of thermal performance and flow non-uniformity

Thermal-hydraulic modeling work for manifold microchannels (MMC) is now published in International Communications in Heat and Mass Transfer. This work accounts for the effect of non-uniform flow distribution on the thermal performance of MMC for the first time. We are looking forward to various derivative works based on the proposed one-dimensional model.

Hansol Lee, Sung Jin Kim

April, 2023 In 2023 KSME TED

Thermal Performance Prediction of Liquid-cooled Manifold Microchannel (MMC) Heat Sinks with Plate Fins

This material was presented in 2023 KSME TED. The newly developed semi-analytical heat transfer model of MMC heat sinks is proposed and the prediciton of the model shows good agreement with experimental data within 20% margin of error.